Conductive Ink / Paste

Stock No.

NS6130-01-157

CAS

7440-57-5/7440-31-5

MSDS

Specifications

COA

Catalogue

Gold Tin Solder Paste

AuSn, Purity: 99.9%, APS: 80-100nm

Gold Tin Solder Paste

Available Pack Size: 10Gms, 25Gms, 50Gms, 100Gms, 250Gms, 500Gms, 1Kg & Bulk orders

Corona-55^®

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Particles Size Analysis - Gold Tin Solder Paste

Product	Gold Tin Solder Paste
Product Indication	.
Indication	NS6130-01-157
Alloy	Sn20/Au80 (Standard), Sn25/Au75 (upon request), Other alloys are available on request
Physical Properties	.
Particle Size	80-100nm
Shape	Spherical
Melting Point	Sn20/Au80 = 280°C, Sn25/Au75 = 280°C
Composition	Sn20/Au80
Density	Sn20/Au80 = 7.4 g/cc, Sn25/Au75 = 7.4 g/cc
Solder Paste	.
Metal Content	Standard 89% ± 1%
Viscosity Range	130 ± 40 Pas, Physica CSS 10 s-1
Density	3.99 ± 0.2 g/ml
Performance Properties	.
Typical Print Thickness	0.4 – 0.65 mm pitch: 150 microns, <0.4 mm pitch: 120 microns
Minimum Pitch	16 mil (400 microns)
Minimum Pad Width	8 mil (200µm, Stencil Thickness -150 µm
Quality Control	Each Lot of was tested successfully
Main Inspect Verifier	Manager QC

Typical Chemical Analysis

Assay	99.9%
Other Metal	< 750 ppm

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Gold Tin Solder Paste

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