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Product | Gold Tin Solder Paste | |
Product Indication | . | |
Indication | NS6130-01-157 | |
Alloy | Sn20/Au80 (Standard), Sn25/Au75 (upon request), Other alloys are available on request | |
Physical Properties | . | |
Particle Size | 80-100nm | |
Shape | Spherical | |
Melting Point | Sn20/Au80 = 280°C, Sn25/Au75 = 280°C | |
Composition | Sn20/Au80 | |
Density | Sn20/Au80 = 7.4 g/cc, Sn25/Au75 = 7.4 g/cc | |
Solder Paste | . | |
Metal Content | Standard 89% ± 1% | |
Viscosity Range | 130 ± 40 Pas, Physica CSS 10 s-1 | |
Performance Properties | . | |
Typical Print Thickness | 0.4 – 0.65 mm pitch: 150 microns, <0.4 mm pitch: 120 microns | |
Minimum Pitch | 16 mil (400 microns) | |
Minimum Pad Width | 8 mil (200µm, Stencil Thickness -150 µm | |
Quality Control | Each Lot of Gold Tin Solder Paste was tested successfully | |
Main Inspect Verifier | Manager QC |
Assay | 99.9% |
Other Metal | < 750 ppm |