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Conductive Ink / Paste

Stock No.
NS6130-01-157
CAS
7440-57-5/7440-31-5
MSDS
MSDS-PDF
Specifications
SPEC-PDF
COA
COA-PDF
Catalogue

Gold Tin Solder Paste

AuSn, Purity: 99.9%, APS: 80-100nm
Gold Tin Solder Paste
Available Pack Size: 10Gms, 25Gms, 50Gms, 100Gms, 250Gms, 500Gms, 1Kg & Bulk orders
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Particles Size Analysis - Gold Tin Solder Paste
ProductGold Tin Solder Paste
Product Indication.
IndicationNS6130-01-157
AlloySn20/Au80 (Standard), Sn25/Au75 (upon request), Other alloys are available on request
Physical Properties.
Particle Size80-100nm
ShapeSpherical
Melting PointSn20/Au80 = 280°C, Sn25/Au75 = 280°C
CompositionSn20/Au80
DensitySn20/Au80 = 7.4 g/cc, Sn25/Au75 = 7.4 g/cc
Solder Paste.
Metal ContentStandard 89% ± 1%
Viscosity Range130 ± 40 Pas, Physica CSS 10 s-1
Performance Properties.
Typical Print Thickness0.4 – 0.65 mm pitch: 150 microns, <0.4 mm pitch: 120 microns
Minimum Pitch16 mil (400 microns)
Minimum Pad Width8 mil (200µm, Stencil Thickness -150 µm
Quality ControlEach Lot of Gold Tin Solder Paste was tested successfully
Main Inspect VerifierManager QC
Typical Chemical Analysis
Assay 99.9%
Other Metal< 750 ppm

Expert Reviews

nanoshel-experts

Gold Tin Solder Paste

Contact Us:
From us, you can easily purchase Gold Tin Solder Paste (AuSn, Purity: 99.9%, APS: 80-100nm) at great prices. Place an online order and we will dispatch your order through DHL, FedEx, UPS. You can also request a quote by mailing us at sales@nanoshel.com. We invite you to contact us for further information about our company and our capabilities. At Nanoshel, we look forward to your suggestions and feedback.
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Gold Tin Solder Paste (AuSn, Purity: 99.9%, APS: 80-100nm)