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Product | Copper Foam | |
Stock No | NS6130-10-1005 | |
CAS | 7440-50-8 | |
Thickness | 1mm | Confirm |
PPI | 110 | Confirm |
Size | 500×500mm | Confirm |
Pore Size | 0.1mm-1mm (110ppi) | Confirm |
Porosity | 50%-98% | Confirm |
Molecular Formula | Cu | Confirm |
Molecular Weight | 63.55g/mol | Confirm |
Density | 8.96g/cm3 | Confirm |
Melting Point | 1085°C | Confirm |
Boiling Point | 2562°C | Confirm |
Thermal Expansion | 16.5µm.m-1.k-1 | Confirm |
Thermal Conductivity | 401W.m-1.k-1 | Confirm |
Tensile Strength | 1.25N/mm | Confirm |
Young’s modulus | 110-128GPa | Confirm |
Shear strength | 190Psi | Confirm |
Vickers hardness | 369MPa | Confirm |
Poisson’s ratio | 0.34 | Confirm |
Electrical resistivity | 1.673µΩ-cm | Confirm |
Specific heat | 0.39kj/kgK | Confirm |
Electronegativity | 1.90paulings | Confirm |
Heat of fusion | 13.26kJ.mol-1 | Confirm |
Heat of vaporization | 300.4kJ.mol-1 | Confirm |
Quality Control | Each Lot of Copper Foam was tested successfully | |
Main Inspect Verifier | Manager QC |
Assay | >99.8% |
Other Metal | 1500ppm |